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XHFC-PT201 Standard Rosin Flux

Series Name:Liquid Flux
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Intro
    Halide percentage 0.2±0.03%. Spreading sector≥91%。 Suitable for foam, spray and wave methods. Designed for weak solderability substrate and different sodlerability between PCB and components.
    If removal is necessary , it is easily removed.
 
Parameter
SGS